Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition

  • Wen-Yin Ko1,

    Affiliated with

    • Wei-Hung Chen1,

      Affiliated with

      • Ching-Yuan Cheng2 and

        Affiliated with

        • Kuan-Jiuh Lin1Email author

          Affiliated with

          Nanoscale Research Letters20105:795

          DOI: 10.1007/s11671-010-9539-8

          Published: 29 January 2010

          The original article was published in Nanoscale Research Letters 2009 4:1481

          Unfortunately, the corresponding author name has been misspelled in the published version this paper[1].

          Instead of Kaun-Jiuh Lin it should be Kuan-Jiuh Lin.


          Authors’ Affiliations

          Department of Chemistry, Center of Nanoscience and Nanotechnology, National Chung-Hsing University
          Experimental Facility Division, National Synchrotron Research Center


          1. Ko Wen-Yin, Chen Wei-Hung, Cheng Cheng-Yuan, Lin Kuan-Jiuh: Architectural Growth of Cu Nanoparticles Through Electrodeposition. Nanoscale Research Letters 2009,4(12):1481. 10.1007/s11671-009-9424-5View Article


          © The Author(s) 2010