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Table 2 Wetting angles before and after reflow process for different surfaces

From: An Organic Metal/Silver Nanoparticle Finish on Copper for Efficient Passivation and Solderability Preservation

Process

Reflow cycles

Wetting angle [°]

Wetting angle after ageing at 155 °C for 4 h [°]

Established metallic surface finishes

0

15

20

1

25

30

2

30

35

3

45

50

4

60

70

Organic metal/silver nanoparticle finish

0

15–20

25–30

1

20–25

25–30

2

25–30

25–30

3

20–30

30–35

4

30–35

30–40

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