- Nano Express
- Open Access
Facile Fabrication of Ultrafine Copper Nanoparticles in Organic Solvent
© to the authors 2009
Received: 20 January 2009
Accepted: 24 March 2009
Published: 10 April 2009
A facile chemical reduction method has been developed to fabricate ultrafine copper nanoparticles whose sizes can be controlled down to ca. 1 nm by using poly(N-vinylpyrrolidone) (PVP) as the stabilizer and sodium borohyrdride as the reducing agent in an alkaline ethylene glycol (EG) solvent. Transmission electron microscopy (TEM) results and UV–vis absorption spectra demonstrated that the as-prepared particles were well monodispersed, mostly composed of pure metallic Cu nanocrystals and extremely stable over extended period of simply sealed storage.
Nanoparticles of the coinage metals have raised great attention due to their fascinating optical, electronic, and catalytic properties [1–3]. In the last two decades, a substantial body of research has been directed toward the synthesis and application of Au and Ag nanoparticles. Brilliant achievements have been made toward the successful control of the nanoparticle sizes and shapes , and the broad applications in optical waveguides , catalysis , surface-enhanced Raman scattering (SERS) , and surface-enhanced IR absorption spectroscopy (SEIRAS) [5, 6]. Copper is a highly conductive, much cheaper, and industrially widely used material, possessing a valence shell electron structure similar to the other two coinage metals. Furthermore, it is unique with the chemical reactivity capable of serving as precursors for the fabrication of conductive structures by ink-jet printing  or forming CuInSe2 or CuIn x Ga1−xSe2 semiconducting nanomaterials for photodetectors and photovoltaics . Nevertheless, over the years, fabrication of Cu nanoparticles has received less attention as compared to that of Au and Ag ones [7, 9–17], and is still open for more intensive investigations.
Several methods have been developed for the preparation of copper nanoparticles, including thermal reduction , sonochemical reduction , metal vapor synthesis , chemical reduction [7, 11, 14, 15], vacuum vapor deposition , radiation methods , and microemulsion techniques . Among all these methods as mentioned, chemical reduction in aqueous or organic solvents exhibits the greatest feasibility to be extended to further applications in terms of its simplicity and low cost. However, Cu nanoparticles so far obtained via the chemical reduction tactics are mostly located in the range of 10–50 nm, and well dispersed Cu nanoparticles with a mean diameter of 5.1 nm could only be synthesized in a CTAB solution . As is well known, the chemical and physical properties including catalytic activities and melting points of the metal nanoparticles are significantly influenced by the particle size . Along this line, synthesis of copper nanoparticles with smaller sizes based on simple chemical reduction is highly demanded.
Here, we present a facile fabrication of ultrafine and monodispersed copper nanoparticles in an organic solvent with average diameters down to 1.4 ± 0.6 nm. The whole synthesis was just taken at room temperature under nitrogen atmosphere. Poly(N-vinylpyrrolidone) (PVP) was used as the stabilizer and sodium borohyrdride as the main reducing agent in the alkaline solvent. Ethylene glycol (EG) was chosen as the solvent for better preventing the oxidation and aggregation of the nanoparticles. The characterization of the Cu colloids was accomplished by using transmission electron microscopy (TEM) as well as UV–vis spectroscopy.
Preparation of Copper Nanoparticles
Synthesis of ultrafine copper nanoparticles in organic solvent was typically processed as follows. A certain amount of poly(N-vinylpyrrolidone) (PVP, MW = 55,000), acting as the capping molecule, was dissolved in ethylene glycol (EG) in a flask. Afterward, at room temperature, copper(II) sulfate (1.5 ml of a 0.1 M solution in EG) was added under strong magnetic stirring followed by adjusting the solution pH up to 11 with dropwise addition of 1 M NaOH EG solution. After stirring for an additional 10 min, 4 ml of 0.5 M NaBH4EG solution was quickly added into the flask. In the first few minutes, the deep blue solution gradually became colorless, and then it turned burgundy, suggestive of the formation of a copper colloid. All procedures were carried out with nitrogen gas bubbling to prevent the reoxidation of reduced copper.
The ultrafine copper nanoparticles were characterized using transmission electron microscopy (TEM) (JEOL JEM-2010) with an accelerating voltage of 100 kV. TEM samples were prepared by placing a drop of a dilute dispersion of Cu nanoparticles on the surface of a 400-mesh copper grid backed with Formvar and were dried in a vacuum chamber for 20 min. The UV–vis absorbance was measured on a PerkinElmer LAMBDA 40 spectrometer.
Results and Discussion
It should be pointed out that in a traditional polyol process to obtain metal nanoparticles, EG acts not only as an organic solvent but also as a reducing agent . The use of EG to reduce Cu(II) species at a relative high temperature would produce Cu nanoparticles >30 nm due to its inherently mild reducing ability . At room temperature, EG is unlikely involved in the reduction of Cu(II) species, and the introduction of a much stronger reducing agent is believed to be a crucial factor for achieving much smaller particle sizes, given that the nucleation and growth processes are greatly dependent on the power of reducing agent . Briefly, weaker reducing agents benefit further growth of the existing nuclei leading to larger particles. With stronger reducing agent, the larger nucleation probability would be expected, in favor of the formation of more ultrafine nanoparticles.
Along this line, the use of stronger reducing agent NaBH4played an important role as well in the controlled synthesis of ultrafine copper nanoparticles in this study. The reduction ability of NaBH4is related to its concentration and the solution pH. For a given concentration, the solution pH should be properly regulated to attain a satisfactory size control. We found that for 0.5 M NaBH4, pH 11 was optimized for the fabrication of ultrafine copper nanoparticles. At too low pH, rapid release of strong hydrogen bubbles produces large amount of Cu nuclei, which tend to aggregate into large agglomerates; at too high pH, newly reduced Cu atoms prefer to deposit onto the nuclei already formed, eventually causing larger Cu nanoparticles.
In summary, nominally reduced Cu nanoparticles was synthesized by a modified polyol method, leading to ultrafine nanoparticles ranging from 1.4 ± 0.6 nm to 3.1 ± 0.5 nm in average with narrow size distribution, uniform shape, and great stability. The size of the nanoparticles decreases with increasing the ratio of PVP and Cu(II) concentrations in the precursor solution by using NaBH4as the reducing agent. The organic solution EG, stabilizer PVP, and the pH value showed a co-effect to ensure the formation of the desired particles, and the reduction process may go through Cu(II) → Cu(I) → Cu(0).
This work is supported by the NSFC (Nos. 20673027 and 20833005) and Sino-German IRTG program.
- Oldenburg SJ, Averitt RD, Westcott SL, Halas NJ: Chem Phys Lett. 1998, 288: 243. ; COI number [1:CAS:528:DyaK1cXjtVamtLY%3D]; Bibcode number [1998CPL...288..243O] 10.1016/S0009-2614(98)00277-2View ArticleGoogle Scholar
- Henglein A: J Phys Chem B. 2000, 104: 6683. COI number [1:CAS:528:DC%2BD3cXktlOrurk%3D] 10.1021/jp000746jView ArticleGoogle Scholar
- Michaels AM, Jiang J, Brus L: J Phys Chem B. 2000, 104: 11965. COI number [1:CAS:528:DC%2BD3cXot1Khu7Y%3D] 10.1021/jp0025476View ArticleGoogle Scholar
- Sun YG, Xia YN: Science. 2002, 298: 2176. ; COI number [1:CAS:528:DC%2BD38XpsVSkt7Y%3D]; Bibcode number [2002Sci...298.2176S] 10.1126/science.1077229View ArticleGoogle Scholar
- Huo SJ, Li QX, Yan YG, Chen Y, Cai WB, Xu QJ, Osawa M: J Phys Chem B. 2005, 109: 15985. COI number [1:CAS:528:DC%2BD2MXmvVCrsrg%3D] 10.1021/jp052585vView ArticleGoogle Scholar
- Huo SJ, Xue XK, Li QX, Xu SF, Cai WB: J Phys Chem B. 2006, 110: 25721. COI number [1:CAS:528:DC%2BD28Xht1anurnN] 10.1021/jp064036aView ArticleGoogle Scholar
- Jeong S, Woo K, Kim D, Lim S, Kim JS, Shin H, Xia Y, Moon J: Adv Funct Mater. 2008, 18: 679. COI number [1:CAS:528:DC%2BD1cXktFGis70%3D] 10.1002/adfm.200700902View ArticleGoogle Scholar
- Tang J, Hinds S, Kelley SO, Sargent EH: Chem Mater. 2008, 20: 6906. COI number [1:CAS:528:DC%2BD1cXhtlSqtLnN] 10.1021/cm801655wView ArticleGoogle Scholar
- Dhas NA, Raj CP, Gedanken A: Chem Mater. 1998, 10: 1446. COI number [1:CAS:528:DyaK1cXis12nt7o%3D] 10.1021/cm9708269View ArticleGoogle Scholar
- Vitulli G, Bernini M, Bertozzi S, Pitzalis E, Salvadori P, Coluccia S, Martra G: Chem Mater. 2002, 14: 1183. COI number [1:CAS:528:DC%2BD38XhsFait7g%3D] 10.1021/cm011199xView ArticleGoogle Scholar
- Huang HH, Yan FQ, Kek YM, Chew CH, Xu GQ, Ji W, Oh PS, Tang SH: Langmuir. 1997, 13: 172. COI number [1:CAS:528:DyaK2sXktlan] 10.1021/la9605495View ArticleGoogle Scholar
- Liu ZW, Bando Y: Adv Mater. 2003, 15: 303. COI number [1:CAS:528:DC%2BD3sXitlOjsr8%3D] 10.1002/adma.200390073View ArticleGoogle Scholar
- Kumar RV, Mastai Y, Diamant Y, Gedanken A: J Mater Chem. 2001, 11: 1209. COI number [1:CAS:528:DC%2BD3MXit1Gis78%3D] 10.1039/b005769jView ArticleGoogle Scholar
- Wu SH, Chen DH: J Colloid Interface Sci. 2004, 273: 165. COI number [1:CAS:528:DC%2BD2cXisFCns7g%3D] 10.1016/j.jcis.2004.01.071View ArticleGoogle Scholar
- Park BK, Jeong S, Kim D, Moon J, Lim S, Kim JS: J Colloid Interface Sci. 2007, 311: 417. COI number [1:CAS:528:DC%2BD2sXlsFansrw%3D] 10.1016/j.jcis.2007.03.039View ArticleGoogle Scholar
- Casella IG, Cataldi TRI, Guerrieri A, Desimoni E: Anal Chim Acta. 1996, 335: 217. COI number [1:CAS:528:DyaK28Xnt1Kmu7s%3D] 10.1016/S0003-2670(96)00351-0View ArticleGoogle Scholar
- Lisiecki I, Pileni MP: J Am Chem Soc. 1993, 115: 3887. COI number [1:CAS:528:DyaK3sXisVWksLo%3D] 10.1021/ja00063a006View ArticleGoogle Scholar
- Yanase A, Komiyama H: Surf Sci. 1991, 248: 11. ; COI number [1:CAS:528:DyaK3MXltVShs7s%3D]; Bibcode number [1991SurSc.248...11Y] 10.1016/0039-6028(91)90056-XView ArticleGoogle Scholar
- Lisiecki I, Billoudet F, Pileni MP: J Phys Chem. 1996, 100: 4160. COI number [1:CAS:528:DyaK28XhtVKksb8%3D] 10.1021/jp9523837View ArticleGoogle Scholar
- Shirtcliffe N, Nickel U, Schneider S: J Colloid Interface Sci. 1999, 211: 122. COI number [1:CAS:528:DyaK1MXhtlOlsLk%3D] 10.1006/jcis.1998.5980View ArticleGoogle Scholar
- Jiang P, Li SY, Xie SS, Gao Y, Song L: Chem Eur J. 2004, 10: 4817. COI number [1:CAS:528:DC%2BD2cXoslegu78%3D] 10.1002/chem.200400318View ArticleGoogle Scholar
- Shin HS, Yang HJ, Kim SB, Lee MS: J Colloid Interface Sci. 2004, 274: 89. COI number [1:CAS:528:DC%2BD2cXjsFOgs78%3D] 10.1016/j.jcis.2004.02.084View ArticleGoogle Scholar
- Zhang ZT, Zhao B, Hu LM: J Solid State Chem. 1996, 121: 105. ; COI number [1:CAS:528:DyaK28Xpt1Wqug%3D%3D]; Bibcode number [1996JSSCh.121..105Z] 10.1006/jssc.1996.0015View ArticleGoogle Scholar
- Bock C, Paquet C, Couillard M, Botton GA, MacDougall BR: J Am Chem Soc. 2004, 126: 8028. COI number [1:CAS:528:DC%2BD2cXksVGqtro%3D] 10.1021/ja0495819View ArticleGoogle Scholar