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Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition

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The original article was published in Nanoscale Research Letters 2009 4:1481

Unfortunately, the corresponding author name has been misspelled in the published version this paper[1].

Instead of Kaun-Jiuh Lin it should be Kuan-Jiuh Lin.

References

  1. 1.

    Ko Wen-Yin, Chen Wei-Hung, Cheng Cheng-Yuan, Lin Kuan-Jiuh: Architectural Growth of Cu Nanoparticles Through Electrodeposition. Nanoscale Research Letters 2009,4(12):1481. 10.1007/s11671-009-9424-5

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Correspondence to Kuan-Jiuh Lin.

Additional information

Erratum to Nanoscale Res Lett (2009) 4:1481–1485, DOI 10.1007/s11671-009-9424-5

The online version of the original article can be found at 10.1007/s11671-009-9424-5

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Open Access This article is distributed under the terms of the Creative Commons Attribution 2.0 International License (https://creativecommons.org/licenses/by/2.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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Ko, W., Chen, W., Cheng, C. et al. Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition. Nanoscale Res Lett 5, 795 (2010) doi:10.1007/s11671-010-9539-8

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