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Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition
Nanoscale Research Letters volume 5, Article number: 795 (2010)
- The original article was published in Nanoscale Research Letters 2009 4:1481
Unfortunately, the corresponding author name has been misspelled in the published version this paper.
Instead of Kaun-Jiuh Lin it should be Kuan-Jiuh Lin.
Ko Wen-Yin, Chen Wei-Hung, Cheng Cheng-Yuan, Lin Kuan-Jiuh: Architectural Growth of Cu Nanoparticles Through Electrodeposition. Nanoscale Research Letters 2009,4(12):1481. 10.1007/s11671-009-9424-5
Erratum to Nanoscale Res Lett (2009) 4:1481–1485, DOI 10.1007/s11671-009-9424-5
The online version of the original article can be found at 10.1007/s11671-009-9424-5
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Ko, W., Chen, W., Cheng, C. et al. Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition. Nanoscale Res Lett 5, 795 (2010). https://doi.org/10.1007/s11671-010-9539-8