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Open Access

Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition

  • Wen-Yin Ko1,
  • Wei-Hung Chen1,
  • Ching-Yuan Cheng2 and
  • Kuan-Jiuh Lin1Email author
Nanoscale Research Letters20105:795

Published: 29 January 2010

The original article was published in Nanoscale Research Letters 2009 4:1481

Unfortunately, the corresponding author name has been misspelled in the published version this paper[1].

Instead of Kaun-Jiuh Lin it should be Kuan-Jiuh Lin.


Authors’ Affiliations

Department of Chemistry, Center of Nanoscience and Nanotechnology, National Chung-Hsing University, Taichung, ROC
Experimental Facility Division, National Synchrotron Research Center, Hsinchu, ROC


  1. Ko Wen-Yin, Chen Wei-Hung, Cheng Cheng-Yuan, Lin Kuan-Jiuh: Architectural Growth of Cu Nanoparticles Through Electrodeposition. Nanoscale Research Letters 2009,4(12):1481. 10.1007/s11671-009-9424-5View ArticleGoogle Scholar


© The Author(s) 2010