Table 2 The fitted values of mass density (ρ), melting temperature (T M), vaporization temperature (T V), latent heat of fusion (L M), latent heat of vaporization (L V), lattice specific heat (C l), lattice thermal conductivity (K l) and electron-phonon coupling constant (g) for Ni and SiO2 used in the thermal spike simulations [30, 44, 45].
Parameter | Ni | SiO2 |
---|---|---|
ρ (g cm-3) | 8.9 | 2.62 (solid), 2.32 (liquid) |
T M (K) | 1,726 | 1,950 |
T V (K) | 3,005 | 3,223 |
L M (J g-1) | 290.3 | 142 |
L V (J g-1) | 6,442 | 4,715 |
C l (J g-1 K-1) | 0.39 + 1.9 × 10-4T-3.3 × 10-8T2+3.8 × 10-11T3; (300 < T < T m), | 0.65 + 3.297 × 10-4T; (300 < T < T M), |
0.62; (T > TM). | 1.3-3 × 10-7 T; (T > T M). | |
K l (WK-1cm-1) | 3.4-1.3 × 10-2T+2.12 × 10-5 T2- 1.5 × 10-8T3+3.6 × 10-12T4; | 1 × 10-3 (T > 300) |
(100 < T < T M), 0.5 (T > T M) | ||
g l (W cm-3 K-1) | 9.54 × 1011 | 1.25 × 1013 |