Table 1 Summary of studies on CHF of nanofluids in pool boiling
From: Enhancement of critical heat flux in nucleate boiling of nanofluids: a state-of-art review
Reference | Nanofluids | Concentration | Test heater | CHF enhancement |
---|---|---|---|---|
[5] | Al2O3 in water | 0.001-0.025 g/l | Cu plate (10 × 10 mm2) | 200%, (19.9 kPa) |
[6] | SiO2 (15, 50, 3,000 nm) in water | 0.5 vol.% | NiCr wire (ϕ = 1 mm) | 60% |
[72] | Al2O3 (38 nm) in water | 0.037 g/l | Ti layer on glass | 70% |
[45] | TiO2 (27, 85 nm) in water | 0.01-3 vol.% | Cu plate | 50% |
[22] | Al2O3 (70-260 nm), ZnO in water; Al2O3 in ethylene glycol | - | Cu plate | 200% |
[47] | Al2O3 (47 nm) in water | 0.5-4 vol.% | SS plate (4 × 100 mm2) | 50% |
[73] | Gold (3 nm) in water, 2.3 kPa | - | Cu disk (1 cm2) | 180% |
SiO2 (10-20 nm) in ionic solution of water | 0.5 vol.% | NiCr wire (ϕ = 0.32 mm) | 220-320% | |
TiO2 (23 nm) | 10-5-10-1 vol.% | NiCr wire (ϕ = 0.2 mm) | 100% | |
Al2O3 (47 nm) in water | Ti wire (ϕ = 0.25 mm) | 80% | ||
SiO2 (10 nm) | 170% | |||
Al2O3 (110-210 nm) | 10-3-10-1 vol.% | SS wire (ϕ = 0.381 mm) | 50% | |
ZrO2 (110-250 nm) in water | 75% | |||
SiO2 (20-40 nm) | 80% | |||
[20] | CuO (30 nm) in water | 0.1-2.0 wt.% | Cu plate (40 × 40 mm2); with grooves | 50%, (100 kPa) |
140%, (31.2 kPa) | ||||
220% (7.4 kPa) | ||||
[57] | Al2O3 (45 nm) in water and ethanol | 0.001-10 g/l | Glass, Au, and Cu surfaces | 40% |
[21] | CuO (59 nm) and SiO2 (35 nm) in water and alcohol (C2H4OH) with SDBS surfactant | 0.2-2 wt.% | Cu disk (ϕ = 20 mm) | 30% |
[19] | Al2O3 (22.6, 46 nm) in water | 0.0006-0.01 g/l | NiCr wire (ϕ = 0.64 mm) | 50% |
BiO2 (38 nm) | 33% | |||
[23] | Al2O3 (<25 nm) in water | 10-4-10-1 g/l | Cu disk (ϕ = 10 and 15 mm) | 70% |
Ag (3, 10, 80, 150, 250 nm) | 35% | |||
[35] | Single-walled CNT in water with hydrochloric acid | 2 wt.% | NiCr wire (ϕ = 0.32 mm) | 300% |
[74] | Multi-walled CNT in water with PVP polymer | 10-4-10-2, 0.05 vol.% | Cu plate (9.5 × 9.5 mm2) Ti wire (ϕ = 0.25 mm) | 200% (19.9 kPa) 140% (19.9 kPa) |
[36] | Cu (10-20 nm) in water | 0.25, 0.5, 1.0 wt.% | Plate (30 × 30 mm2) | |
w/ SDS surfactant | 50% | |||
w/o SDS surfactant | -30% | |||
[69] | TiO2 (45 nm) and Al2O3 (47 nm) in water | 0.01 vol.% | Cu and Ni disks (ϕ = 20 mm) | 40% |
Al2O3 (139 nm), CuO (143 nm), Diamond (86 nm) in water | 0.001-1 g/l | Cu plate (10 × 10 mm2) | 80% | |
[27] | CNT in water with nitric acid for pH 6.5; | 0.5-4 wt.% | Cu plate (40 × 40 mm2) | 60% (100 kPa) |
140% (31.2 kPa) | ||||
200% (7.4 kPa) | ||||
[63] | Graphene in water | 0.001 vol.% | NiCr wire | 84% |
Graphene-oxide in water | 179% | |||
Al2O3 in water | 152% |