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Table 1 Summary of studies on CHF of nanofluids in pool boiling

From: Enhancement of critical heat flux in nucleate boiling of nanofluids: a state-of-art review

Reference

Nanofluids

Concentration

Test heater

CHF enhancement

[5]

Al2O3 in water

0.001-0.025 g/l

Cu plate (10 × 10 mm2)

200%, (19.9 kPa)

[6]

SiO2 (15, 50, 3,000 nm) in water

0.5 vol.%

NiCr wire (ϕ = 1 mm)

60%

[72]

Al2O3 (38 nm) in water

0.037 g/l

Ti layer on glass

70%

[45]

TiO2 (27, 85 nm) in water

0.01-3 vol.%

Cu plate

50%

[22]

Al2O3 (70-260 nm), ZnO in water; Al2O3 in ethylene glycol

-

Cu plate

200%

[47]

Al2O3 (47 nm) in water

0.5-4 vol.%

SS plate (4 × 100 mm2)

50%

[73]

Gold (3 nm) in water, 2.3 kPa

-

Cu disk (1 cm2)

180%

[32, 33]

SiO2 (10-20 nm) in ionic solution of water

0.5 vol.%

NiCr wire (ϕ = 0.32 mm)

220-320%

[18, 53, 59, 60]

TiO2 (23 nm)

10-5-10-1 vol.%

NiCr wire (ϕ = 0.2 mm)

100%

 

Al2O3 (47 nm) in water

 

Ti wire (ϕ = 0.25 mm)

80%

 

SiO2 (10 nm)

  

170%

[46, 55]

Al2O3 (110-210 nm)

10-3-10-1 vol.%

SS wire (ϕ = 0.381 mm)

50%

 

ZrO2 (110-250 nm) in water

  

75%

 

SiO2 (20-40 nm)

  

80%

[20]

CuO (30 nm) in water

0.1-2.0 wt.%

Cu plate (40 × 40 mm2); with grooves

50%, (100 kPa)

    

140%, (31.2 kPa)

    

220% (7.4 kPa)

[57]

Al2O3 (45 nm) in water and ethanol

0.001-10 g/l

Glass, Au, and Cu surfaces

40%

[21]

CuO (59 nm) and SiO2 (35 nm) in water and alcohol (C2H4OH) with SDBS surfactant

0.2-2 wt.%

Cu disk (ϕ = 20 mm)

30%

[19]

Al2O3 (22.6, 46 nm) in water

0.0006-0.01 g/l

NiCr wire (ϕ = 0.64 mm)

50%

 

BiO2 (38 nm)

  

33%

[23]

Al2O3 (<25 nm) in water

10-4-10-1 g/l

Cu disk (ϕ = 10 and 15 mm)

70%

 

Ag (3, 10, 80, 150, 250 nm)

  

35%

[35]

Single-walled CNT in water with hydrochloric acid

2 wt.%

NiCr wire (ϕ = 0.32 mm)

300%

[74]

Multi-walled CNT in water with PVP polymer

10-4-10-2, 0.05 vol.%

Cu plate (9.5 × 9.5 mm2)

Ti wire (ϕ = 0.25 mm)

200% (19.9 kPa)

140% (19.9 kPa)

[36]

Cu (10-20 nm) in water

0.25, 0.5, 1.0 wt.%

Plate (30 × 30 mm2)

 
 

w/ SDS surfactant

  

50%

 

w/o SDS surfactant

  

-30%

[69]

TiO2 (45 nm) and Al2O3 (47 nm) in water

0.01 vol.%

Cu and Ni disks (ϕ = 20 mm)

40%

[28, 75, 76]

Al2O3 (139 nm), CuO (143 nm), Diamond (86 nm) in water

0.001-1 g/l

Cu plate (10 × 10 mm2)

80%

[27]

CNT in water with nitric acid for pH 6.5;

0.5-4 wt.%

Cu plate (40 × 40 mm2)

60% (100 kPa)

    

140% (31.2 kPa)

    

200% (7.4 kPa)

[63]

Graphene in water

0.001 vol.%

NiCr wire

84%

 

Graphene-oxide in water

  

179%

 

Al2O3 in water

  

152%

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