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Figure 4 | Nanoscale Research Letters

Figure 4

From: Comparison of nickel silicide and aluminium ohmic contact metallizations for low-temperature quantum transport measurements

Figure 4

Dynamic hysteresis in the magnetoresistance measured at base temperature. Figure 4a shows the hysteresis in the magnetoresistance of the aluminium contacted Hall bar as a function of magnetic field sweep rate. At a fast sweep rate of 0.2 T/min clear hysteresis is observable, but disappears for sweep rates of 0.1 T/min or lower. Figure 4b shows the same results from a nickel silicide contacted Hall bar. We see comparable behaviour, indicating that the nickel silicidation process does not exacerbate the hysteresis.

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