Figure 3
From: Carbon nanotube bumps for the flip chip packaging system
Illustration of CNT bumps on the Au electrode with three different pitches. The smallest designed pitch is 80 μm in this work. The dimensions of each CNT bump are (a) 170 × 150 μm for structure 1, (b) 120 × 100 μm for structure 2, and (c) 70 × 50 μm for structure 3. The scale bar at the bottom right of each image represents 100 μm.