Figure 4
From: Carbon nanotube bumps for the flip chip packaging system
SEM images of the CNT interconnection bump demonstrated using a flip chip concept. The dimensions of CNT bumps were 100 × 100 μm. (a) Die attached to the carrier at a tilted angle of 75°. (b) Magnified view of two CNT interconnection bumps. (c) CNT from the bottom carrier was observed to be touching the die substrate which is indicative of the connections made.