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Figure 6 | Nanoscale Research Letters

Figure 6

From: Carbon nanotube bumps for the flip chip packaging system

Figure 6

Two-point probe DC measurement across two interconnection bumps measured across the carrier substrate's input and output. The CNT bump dimensions were 150 × 150 μm. (a) Similar I-V characteristics were observed to demonstrate the concept of reworkable process using this form of joining methodology. (b) Equivalent electrical circuit for the measured resistances and CNT interconnection bump.

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