Figure 6
From: Carbon nanotube bumps for the flip chip packaging system
Two-point probe DC measurement across two interconnection bumps measured across the carrier substrate's input and output. The CNT bump dimensions were 150 × 150 μm. (a) Similar I-V characteristics were observed to demonstrate the concept of reworkable process using this form of joining methodology. (b) Equivalent electrical circuit for the measured resistances and CNT interconnection bump.