Figure 6
From: Copper-selective electrochemical filling of macropore arrays for through-silicon via applications
Filling quality of the macropores with copper. SEM polished, sliced views of copper-filled macropores comparing the filling quality of macropores with copper. (a) Using a non-accurate electrolytic solution (JGB concentration equal to 5 ppm) leads to void formation during the copper growth. (b) Using an adapted electrolyte (JGB concentration was increased to 10 ppm) leads to the formation of void-free copper deposition.