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Table 1 Material properties of synthesized epoxysiloxanes and their mixtures

From: A fast thermal-curing nanoimprint resist based on cationic polymerizable epoxysiloxane

Epoxysiloxane Si-H of PMHS (mol%) Viscosity of PMHS (mPa s) Viscosity of epoxysiloxane (mPa s) Properties of cured films
Water contact angle (degrees) Strain at peak (%) Young's modulus (MPa)
I 100 33 257 74.9 1.085 381.930
II 50 to 55 15 60 83.7 1.813 114.553
III 15 28 37 98.9 15.100 10.379
IVa - - 52 91.3 6.300 88.617
Vb - - 112 80.6 1.232 225.063
  1. aIV = 60 wt.% II + 40 wt.% III; bV = 20 wt.% I + 80 wt.% II.