Table 1 Material properties of synthesized epoxysiloxanes and their mixtures
From: A fast thermal-curing nanoimprint resist based on cationic polymerizable epoxysiloxane
Epoxysiloxane | Si-H of PMHS (mol%) | Viscosity of PMHS (mPa s) | Viscosity of epoxysiloxane (mPa s) | Properties of cured films | ||
|---|---|---|---|---|---|---|
Water contact angle (degrees) | Strain at peak (%) | Young's modulus (MPa) | ||||
I | 100 | 33 | 257 | 74.9 | 1.085 | 381.930 |
II | 50 to 55 | 15 | 60 | 83.7 | 1.813 | 114.553 |
III | 15 | 28 | 37 | 98.9 | 15.100 | 10.379 |
IVa | - | - | 52 | 91.3 | 6.300 | 88.617 |
Vb | - | - | 112 | 80.6 | 1.232 | 225.063 |