Table 2 Ingredients of a typical NIL resist used in this study and their functions
From: A fast thermal-curing nanoimprint resist based on cationic polymerizable epoxysiloxane
Ingredient | wt.% | Function |
|---|---|---|
Ia | 1 | Silicon-containing oligomer; increases the viscosity and polarity of resist and provides high cross-linking density |
IIa | 4 | Silicon-containing oligomer; provides oxygen RIE etching resistance and moderate cross-linking density |
IIIa | 0.5 | Silicon-containing oligomer; relieves mechanical properties as plasticizer |
PGMEA | 94.2 | Low-viscosity diluents; improves resist flow for spin coating |
Diphenyliodonium salt | 0.3 | Photo-initiator; generates cationic acids upon exposure to UV radiation |