Table 1 Typical physical properties and figure of merits of candidate materials (300 K)
From: Towards on-chip time-resolved thermal mapping with micro-/nanosensor arrays
Materials | S(μV/K) | ρ(Ωm) | κ(W/m K) | ZT |
---|---|---|---|---|
Cr | 18.8 | 1.27E − 7 | 93.9 | 8.9E − 3 |
Ni | −18 | 7E − 8 | 90.9 | 1.5E − 2 |
Al | −1.7 | 2.65E − 8 | 237 | 1.4E − 4 |
Sia | Approximately −450 | 1.4 | 132 | 3.3E − 7 |
poly-Sia | Approximately −1,200 | 0.36 | 135 | 8.9E − 6 |
n-poly-Sib | −57 | 8.1E − 6 | 31.5 | 3.8E − 3 |
p-poly-Sib | 103 | 2.2E − 5 | 31.2 | 4.6E − 3 |
n-poly-SiGeb | −77 | 2.4E − 5 | 9.4 | 7.9E − 3 |
p-poly-SiGeb | 59 | 1.9E − 5 | 11.1 | 5.0E − 3 |