Figure 3
From: A facile approach to a silver conductive ink with high performance for macroelectronics
Ink properties. (a) TGA and DTG curves (inset, OSC ink). (b) Variation of resistivity sintered at different temperatures for different times. (c) XRD pattern of sintered OSC ink with a solid content of 20 wt.% (the inset shows the top-view SEM image of the conductive film). (d) Lateral view of the SEM image of the silver film sintered at 120°C for 30 s (dimethylformamide was used as reduction agent in the formula).