Figure 3From: Free-field characterization via directional transmission through a nanoapertureProcess flow. The fabrication process flow of the device in Figure 1. (a) Sample. (b) Electron beam patterning of the grooves in resist. (c) Dry etching of the corrugations. (d) Gluing the SiO2 substrate. (e) Template stripping. (f) Resist coating. (g) Patterning of the slit. (h) Dry etching of the slit.Back to article page