Table 2 Etch rate of Si through an Al mask compared to a SiO 2 mask with large openings
Large area Si etch rate (nm/min) | Etch rate through the PAA mask(pore diameter in the range of 35 to 45 nm) nm/min | |
---|---|---|
SF6 | 700 | 140 – 180 |
SF6/O2 | 177 | 140 – 180 |
SF6/CHF3 | 170 | 65 – 85 |