Figure 8From: Quartz resonator assembling with TSV interposer using polymer sealing or metal bondingThe top view and cross-sectional SEM images of quartz resonator and Cu TSV profiles. (a,b) The top view and cross-sectional SEM images of quartz resonator with TSV interposer after thermal reliability investigation and (c,d) the cross-sectional SEM image of Cu TSV profiles with and without thermal process.Back to article page