Table 2 Effects of t off in pulse deposition process on the compositions of (Bi,Sb) 2 - x Te 3 + x materials
Sb | Te | Bi | |
---|---|---|---|
Potentiostatic deposition process | 9.97 | 30.19 | 59.83 |
toff = 0.1 s | 7.09 | 31.29 | 61.63 |
toff = 0.4 s | 7.71 | 51.25 | 41.05 |
toff = 1 s | 12.02 | 69.43 | 18.54 |
toff = 1.6 s | 7.22 | 79.62 | 13.16 |
toff = 2 s | 5.77 | 84.06 | 10.17 |
toff = 4 s | 6.24 | 86.30 | 7.46 |