Junctionless ferroelectric field effect transistors based on ultrathin silicon nanomembranes
© Cao et al.; licensee Springer. 2014
Received: 8 October 2014
Accepted: 11 December 2014
Published: 23 December 2014
The paper reported the fabrication and operation of nonvolatile ferroelectric field effect transistors (FeFETs) with a top gate and top contact structure. Ultrathin Si nanomembranes without source and drain doping were used as the semiconducting layers whose electrical performance was modulated by the polarization of the ferroelectric poly(vinylidene fluoride trifluoroethylene) [P(VDF-TrFE)] thin layer. FeFET devices exhibit both typical output property and obvious bistable operation. The hysteretic transfer characteristic was attributed to the electrical polarization of the ferroelectric layer which could be switched by a high enough gate voltage. FeFET devices demonstrated good memory performance and were expected to be used in both low power integrated circuit and flexible electronics.
KeywordsSilicon nanomembrane Ferroelectric polymer Ferroelectric field effect transistor Junctionless
In the past few years, with the development of silicon-on-insulator (SOI) process techniques , Si nanomembranes (SiNMs) have attracted much attention due to their unique properties, such as piezoelectric effect and high speed carrier mobility, and thereof potential applications in flexible electronics [2–6]. SiNM-based devices can be built on one or both sides, which are more immune to short-channel effects and have advantages such as faster and lower voltage/power operation and the compatible manufacturing process with current integrated circuit [7–11]. As we know, nonvolatile memories are a kind of critical microelectronic devices, among which ferroelectric memories have shown large potential especially in flexible nonvolatile memories based on ferroelectric polymer and oxide  or organic  semiconductors. However, till now, few works have been reported on SiNM-based nonvolatile memories, though such devices are expected to effectively reduce device dimensions, catch up with modern integrated circuit process, and overcome the obstacle in fabricating an ultrashallow junction for ‘gated resistors’ [14, 15]. Here, we report the feasibility and operation of SiNM-based ferroelectric field effect transistor (FeFET) memories.
Results and discussion
Transfer characteristics of our FeFETs were determined by sweeping Vg between ±8 V at a constant Vds of 0.5 V. To well-illuminate the experimental results, we define two Vg scanning directions: forward scan corresponds to Vg sweeping from negative to positive voltage, while backward scan corresponds to Vg from positive to negative voltage. Different from the typical metal-oxide-silicon field effect transistors, in which both transfer curves from the forward and the backward scans follow nearly the same trace, the FeFETs show significant hysteresis during transfer measurements (Figure 2b) due to the insertion of the ferroelectric P(VDF-TrFE) film between the gate and the oxide layers. The transfer loop in Figure 2b shows the device’s on/off ratio of about 102 and the width of memory window of 0.75 V, which is defined as the gap of Vg when Ids is half of its maximum value in a complete hysteresis loop. Furthermore, when the gate voltage is lower than 2.0 V, the gate leakage current Igs is on the order of 10-8 A, about 2 orders of magnitude lower than Ids. During the electrical measurements by probe method, the mechanical stress applied by the probes causes the compression of the insulating layers between gate and source/drain electrodes and thus decreased film thickness results in the increased leakage current Igs between gate and source, as is also shown in the leakage current curve of Figure 2b. With the further increase of Vg from 2 to 8 V, the leakage current quickly increases from 10 nA to 0.7 mA. The increased leakage current partly counteracts the further increase of Ids especially at a gate voltage larger than 2 V and thus results in the decrease of Ids with further increased gate voltage.
Note that both output and transfer characteristics indicate our FeFETs have a typical n-channel depletion mode (NNN), though the device is based on p-doped silicon without special source and drain doping. Here, the n-channel depletion mode is due to aluminum-silicon interaction. The work function of aluminum and electron affinity of silicon are 4.2 and 4.01 eV, respectively. At the Al/Si interface, the separation between the Fermi level and conduct band is only 0.27 eV (<1.12 eV/2), resulting in the change of the type of the silicon to n-type near the interface. At the same time, the channel is changed to n-type by fixed charges in the gate oxide. The same experimental observation was also reported in a similar Al/Si device structure .
The insets in Figure 2b schematically explain the origin of the electrical hysteresis (i.e., memory window) induced by the bistable orientation of electrical dipoles in the ferroelectric layer. These well-oriented dipoles induce a built-in voltage (Vin) which causes the shift of the threshold voltage (Vth) in the semiconducting layer . Note that voltage drop on the ferroelectric layer larger than the coercive voltage (approximately 4.8 V) can lead to re-orientation of the electrical dipoles. During the backward scan, the initial applied gate voltage of +8 V is high enough to cause polarization reversal in the ferroelectric layer with electrical dipoles aligning downwards to the SiNM (inset 1), which contributes positive Vin to the SiNM layer and thus results in a Vth shift toward the negative voltage. On the other hand, during the forward scan, the initial applied voltage of -8 V induces the re-orientation of the dipoles aligning against the SiNM layer (inset 3), causing a Vth shift to the positive voltage. The insets 2 and 4 schematically show the orientation of the electrical dipoles during Vg sweeping, which correspondingly causes the tuning of Vin and then Vth. As a result, a hysteresis loop can be expected as shown in Figure 2b.
Gate voltage determines the polarization in the ferroelectric layer and thus influences the memory window. To explore the mechanism behind this, we carried out more electrical characterizations on our devices. We determined the influence of Vgmax on the memory window, where Vgmax was the applied maximum gate voltage during one measurement of a whole hysteresis loop. Typical results are shown in Figure 3b, where Vds was fixed at 3 V and Vg was swept between ± Vgmax. Obviously, the width of the memory window increases with Vgmax, and the device’s on/off ratio shows negligible change when Vgmax is larger than 6 V. The inset in Figure 3b demonstrates the relationship between window width and Vgmax: in our experimental condition, window width increases linearly from 0.05 to 1.1 V with the increase of Vgmax from 4 to 10 V, indicating more dipole switching and thus larger Vin with the increase of Vgmax.
Note that, in our measurements of transfer characteristic, the whole hysteretic loops shift to the negative gate voltage, as shown in Figures 2b and 3. Such a shift is not due to the built-in voltage caused by the orientation of electrical dipoles in the ferroelectric layer, but due to space charges trapped in the ferroelectric layer and/or the interface between the ferroelectric and its adjacent layers, i.e., imprint effect , which is actually quite common in ferroelectric films and devices . Nevertheless, this shift reduces the memory window measured at Vg = 0 V, resulting in a low on/off ratio of only 1.14 in the retention measurements in Figure 4. In fact, as for the transfer loop shown in Figure 2b, the maximum on/off ratio of 6.3 occurs at a Vg of -4.8 V, while the maximum separation of 0.11 mA between the ON and OFF state Ids values occurs at a Vg of -3.6 V. To get even better memory performance especially at a Vg of 0 V, further measures should be taken to inhibit space-charge-induced shift in transfer measurements.
Although the SiNM-based FeFET device has been fabricated with good memory performance, the device needs to be further optimized. First, compared with the bulk Si, SiNM with a low doping concentration provides fewer carriers to be modulated by the ferroelectric layer, resulting in a lower switching ratio. In order to achieve good FET characteristics, SiNMs should be heavily doped . Second, SiNMs should be even thinner to obtain a high on/off ratio due to easier gate control . Third, SiNMs can be transferred to flexible substrates and thus flexible ‘junctionless’ FeFETs can be expected .
In summary, nonvolatile SiNM-based FeFETs have been fabricated by integrating ferroelectric polymer thin films and ultrathin SiNMs. Electrical characterizations show that such devices have hysteretic transfer characteristic due to the modulation of electrical polarization in the ferroelectric layer. The devices show good memory performance with the device’s on/off ratio up to 102 and memory window width as high as 1.1 V. Such SiNM-based FeFETs exhibit good retention performance and are expected to be used in low power integrated circuit and flexible electronics.
The authors acknowledge the support by the Natural Science Foundation of China (51322201, 61008029, 61076068, and 51102049), Specialized Research Fund for the Doctoral Program of Higher Education (20120071110025), Shanghai Pujiang Program (11PJ1400900), NSAF (U1430106) and Science and Technology Commission of Shanghai Municipality (13NM1400600, 12520706300, and 14JC1400200), and ZhuoXue Plan in Fudan University.
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