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Table 1 MD simulation conditions in 3D nano-machining

From: Influence of cutting parameters on the depth of subsurface deformed layer in nano-cutting process of single crystal copper

Machining parameters

Value

Potential function

Tersoff, Morse, EAM

Workpiece

Single crystal copper

Tool

Diamond

Lattice structure

FCC

Workpiece size

40 nm × 30 nm × 22 nm

Tool rake angleα

15°

Tool clearance angleβ

Tool edge radius R

3.0 nm

Cutting direction

(100) [100]

Cutting depth

1~10 nm

Cutting speed

50~300 m/s

Timestep

1 fs

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