Table 1 MD simulation conditions in 3D nano-machining
Machining parameters | Value |
---|---|
Potential function | Tersoff, Morse, EAM |
Workpiece | Single crystal copper |
Tool | Diamond |
Lattice structure | FCC |
Workpiece size | 40 nm × 30 nm × 22 nm |
Tool rake angleα | 15° |
Tool clearance angleβ | 8° |
Tool edge radius R | 3.0 nm |
Cutting direction | (100) [100] |
Cutting depth | 1~10 nm |
Cutting speed | 50~300 m/s |
Timestep | 1 fs |