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21kAccesses 110Citations 0Mentions

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Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)

Last updated: Thu, 28 Mar 2024 7:55:40 UTC

Accesses

Accesses is an approximate count of unique views and downloads. This number can fluctuate depending on multiple factors.

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21k Accesses

Citations

We get citation counts from Web of Science and CrossRef. Accuracy is dependent on their data availability.

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103 Web of Science

110 CrossRef

Altmetric

Altmetric score
  • 122 Mendeley

Altmetric calculates a score based on the online attention an article gets — the higher the score, the more online attention an article has received.

The transparent donuts are records for research outputs that do not yet have Altmetric Attention Scores (i.e., research outputs with no Altmetric mentions yet).

Transparent donuts might still have underlying attention data, such as Mendeley readers and Dimensions citations, but these data sources do not contribute to the Altmetric score.

The donut will light up when it gets an Altmetric score in future.

View more on Altmetric.

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