Table 1 General types of TSV [26]
From: Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)
Application | Plating | Depth | Diameter | Aspect ratio |
---|---|---|---|---|
Image sensor | Conformal | 50 to 100 | 30 to 50 | 1 to 3 |
Interposer | Full-fill | 50 to 150 | 20 to 30 | 4 to 8 |
Device | Full-fill | 20 to 60 | 2 to 10 | 5 to 15 |