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Table 1 General types of TSV [26]

From: Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)

Application

Plating

Depth

Diameter

Aspect ratio

Image sensor

Conformal

50 to 100

30 to 50

1 to 3

Interposer

Full-fill

50 to 150

20 to 30

4 to 8

Device

Full-fill

20 to 60

2 to 10

5 to 15

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