Fig. 2From: Experimental Study on Thermal Conductivity and Hardness of Cu and Ni Nanoparticle Packed Bed for Thermoelectric ApplicationMicrostructure of Cu and Ni NPBs. a1 Cu with 18 MPa. a2 Cu with 24 MPa. a3 Cu with 32 MPa. b1 Ni with 18 MPa. b2 Ni with 24 MPa. b3 Ni with 32 MPaBack to article page