Fig. 2From: Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle PasteThe SEM images of the sintered nanoparticle pastes after sintering at a 200, b 225 °C, c 250, d 275, and e 300 °C. f The variation of resistivity with the increasing of sintering temperatureBack to article page