Fig. 3From: Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste a The schematic diagram of shear strength test and the tested value of the bonded joint and the aged joint. b The cross-sectional SEM image of the Cu–Cu joint. c The partially magnified bonding interface after bonding at 300 °C for 60 min. d The Cu–Cu bonding interface after isothermal aging at 150 °C for 200 hBack to article page