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Fig. 2 | Nanoscale Research Letters

Fig. 2

From: Study of Effect of Impacting Direction on Abrasive Nanometric Cutting Process with Molecular Dynamics

Fig. 2

Simulation model of SiC abrasive cutting single crystal copper. Figure 2 is about the simulation model of SiC abrasive cutting single crystal copper; we built two SiC abrasive for cutting single crystal copper. In the abrasive flow polishing experiment, the workpiece was usually cut with SiC abrasive. After the construction of SiC abrasive model, the molecular dynamics simulation of the workpiece was carried out. The model of two SiC abrasive cutting monocrystal copper with different angles was constructed

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