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Fig. 9 | Nanoscale Research Letters

Fig. 9

From: Study of Effect of Impacting Direction on Abrasive Nanometric Cutting Process with Molecular Dynamics

Fig. 9

Total energy curve. Figure 9 shows the total energy curve. During the process of SiC cutting the single crystal copper workpiece, the effect of the abrasive grains on the workpiece is manifested in two forms: part of which is converted into kinetic energy, the atomic heat is increased, and local kinetic energy becomes larger when polishing the joint area of the single crystal copper workpiece and the SIC particles; the other part is converted into potential energy, the internal structure of the monocrystal copper workpiece is changed, lattice is deformed, and lattice energy is released and changed into potential energy. a 3D curve. b Contour

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