Table 3 Comparison of device performance for RRAM devices
From: Low-Power Resistive Switching Characteristic in HfO2/TiOx Bi-Layer Resistive Random-Access Memory
Device structure | Type | Iset@Vset | Ireset@Vreset | HRS/LRS | Pset, preset | Reference |
---|---|---|---|---|---|---|
Pt/TiOx/HfO2/Pt | OxRRAM | 1 μA@1.52 V | 1 μA@− 1.12 V | 100 | 1.52 μW, 1.12 μW | This work |
Pt/C/Ta2O5/TiN | OxRRAM | 1 mA@− 1.5 V | 0.3 mA@2.6 V | 100 | 1.5 mW, 0.78 mW | [5] |
TiN/Ti/HfOx/TiN | VRRAM | 100 μA@1.15 V | 92 μA@− 0.98 V | 10 | 115 μW, 90.2 μW | [6] |
Cu/black phosphorus/Au | CBRAM | 0.9 mA@0.71 V | 0.9 mA@− 0.57 V | 1000 | 0.64 mW, 0.51 mW | [7] |
Sn/HfO2/Pt | CBRAM | 1 mA@3.5 V | 6 mA@− 1.67 V | 1e5 | 3.5 mW, 10.02 mW | [8] |
Nb/NiO/Nb | Unipolar | 15 mA@0.82 V | 15 mA@0.38 V | 100 | 12.3 mW, 5.7 mW | [9] |
Ta/Ta2O5/Pt | Unipolar | 1 mA@2.31 V | 8 mA@1 V | 20 | 2.31 mW, 8 mW | [10] |