Fig. 4From: Enhanced Reliability of a-IGZO TFTs with a Reduced Feature Size and a Clean Etch-Stopper Layer StructureXPS analysis of the surface composition of the a-IGZO thin films a before annealing, b after annealing, and c after exposure to the H2O2 Cu etchant during the BCE process. d Corresponding atomic percentages for the above processBack to article page