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Table 1 Comparison table between VLSI and the analogous approach for fibers (VLSI-Fi)

From: Towards Digital Manufacturing of Smart Multimaterial Fibers

 

VLSI

VLSI-Fi

Graphical illustration

2D

Wafer surface by photolithography and chemical and thermal treatment

Fiber cross section by 3D printing of preforms and thermal draw

Fig. 1a

+1D

Layer-by-layer structuring by vertical stacking

Axial patterning by capillary breakup

Fig. 1b

+0D

Doping control by implantation and thermal activation

Segregation-driven structuring by temperature gradient-guided solidi cation

Fig. 1c

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