Table 1 Comparison table between VLSI and the analogous approach for fibers (VLSI-Fi)
From: Towards Digital Manufacturing of Smart Multimaterial Fibers
VLSI | VLSI-Fi | Graphical illustration | |
---|---|---|---|
2D | Wafer surface by photolithography and chemical and thermal treatment | Fiber cross section by 3D printing of preforms and thermal draw | Fig. 1a |
+1D | Layer-by-layer structuring by vertical stacking | Axial patterning by capillary breakup | Fig. 1b |
+0D | Doping control by implantation and thermal activation | Segregation-driven structuring by temperature gradient-guided solidi cation | Fig. 1c |