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Table 1 Comparison table between VLSI and the analogous approach for fibers (VLSI-Fi)

From: Towards Digital Manufacturing of Smart Multimaterial Fibers

  VLSI VLSI-Fi Graphical illustration
2D Wafer surface by photolithography and chemical and thermal treatment Fiber cross section by 3D printing of preforms and thermal draw Fig. 1a
+1D Layer-by-layer structuring by vertical stacking Axial patterning by capillary breakup Fig. 1b
+0D Doping control by implantation and thermal activation Segregation-driven structuring by temperature gradient-guided solidi cation Fig. 1c