Skip to main content
Account

Table 3 Effect of atomic sizing effect and cutting-edge effect on material removal during ACS cutting

From: Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect

 

Ratio of cutting depth to atomic radius (a/rw)

(0, C1)

(C1, C2)

(C2, ∞)

Ratio of cutting depth to edge radius (a/R)

(T1, ∞)

Elastic deformation, no material removal (case 1)

Noncontinuous material removal, chip formation (case 2)

Elastic deformation, chip formation by dislocation motion

Slip of 1 atomic layer (case 3)

(T2, T1)

Slip of over 2 atomic layers (case 4)

(0, T2)

No or extremely small chip formation, elastic-plastic deformation (case 5)

Material removal behaviour

Sliding

Cutting

Navigation