Table 3 Effect of atomic sizing effect and cutting-edge effect on material removal during ACS cutting
From: Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect
Ratio of cutting depth to atomic radius (a/rw) | |||||
---|---|---|---|---|---|
(0, C1) | (C1, C2) | (C2, ∞) | |||
Ratio of cutting depth to edge radius (a/R) | (T1, ∞) | Elastic deformation, no material removal (case 1) | Noncontinuous material removal, chip formation (case 2) | Elastic deformation, chip formation by dislocation motion | Slip of 1 atomic layer (case 3) |
(T2, T1) | Slip of over 2 atomic layers (case 4) | ||||
(0, T2) | No or extremely small chip formation, elastic-plastic deformation (case 5) | ||||
Material removal behaviour | Sliding | Cutting |