Table 1 MD simulation conditions in 3-D nano-machining

Potential function

Tersoff, Morse, EAM

Workpiece (specimen)

Single crystal copper

Tool (indenter)

Diamond

Lattice structure

FCC

Workpiece/specimen size

40 nm × 30 nm × 22 nm

Tool rake angle α

15°

Tool clearance angle β

8°

Tool edge radius r

3.0 nm

Machining direction

(100) [100], (100) [010]

Cutting depth

3 nm

Cutting speed

100 m/s

Indenter diameter d

6.0 nm

Indentation depth

2~4 nm

Indentation speed

50 m/s

Timestep

1 fs