Table 1 Comparison of emerging memory technologies
Memory technology | SRAM | DRAM | NAND Flash | NOR Flash | PCM | STT-MRAM | RRAM |
---|---|---|---|---|---|---|---|
Cell area | > 100F2 | 6F2 | <4F2(3D) | 10F2 | 4– 20F2 | 6– 20F2 | <4F2(3D) |
Cell element | 6T | 1T1C | 1T | 1T | 1T(D)1R | 1(2)T1R | 1T(D)1R |
Voltage | <1 V | <1 V | <10 V | <10 V | <3 V | <2 V | < 3 V |
Read time | ∼1 ns | ∼10 ns | ∼10 μs | ∼50 ns | <10 ns | <10 ns | < 10 ns |
Write time | ∼1 ns | ∼10 ns | 100 μs–1 ms | 10 μs–1 ms | ∼50 ns | <5 ns | < 10 ns |
Write energy (J/bit) | ∼fJ | ∼10 fJ | ∼10 fJ | 100 pJ | ∼10 pJ | ∼0.1 pJ | ∼0.1 pJ |
Retention | N/A | ∼64 ms | >10 y | >10 y | >10 y | >10 y | > 10 y |
Endurance | > 1016 | >1016 | >104 | >105 | >109 | >1015 | ∼106– 1012 |
Multibit capacity | No | No | Yes | Yes | Yes | Yes | Yes |
Non-volatility | No | No | Yes | Yes | Yes | Yes | Yes |
Scalability | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
F: Feature size of lithography |