Fig. 9From: Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal SiliconRelaxation process and vacancies in workpiece. a Snapshot of the damage pattern of workpiece at 1200 K. b Number of the atoms transformed from the non-diamond structure into Si-I phase. c Constructed surface mesh of the workpiece at 1200 K. d The volume of the vacancies at different temperaturesBack to article page