Table 2 The acronyms of the inspection techniques and defects in Fig. 2

SEM: Scanning electron microscopy

OM: Optical microscopy

BPD: Basal plane dislocation

DIC: Differential interference contrast

PL: Photoluminescence

TED: Threading edge dislocation

OCT: Optical coherence tomography

CL: Cathodoluminescence

TSD: Threading screw dislocation

XRT: X-ray topography

Raman: Raman spectroscopy

SF: Stacking faults