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Table 2 The acronyms of the inspection techniques and defects in Fig. 2

From: Defect Inspection Techniques in SiC

SEM: Scanning electron microscopy OM: Optical microscopy BPD: Basal plane dislocation
DIC: Differential interference contrast PL: Photoluminescence TED: Threading edge dislocation
OCT: Optical coherence tomography CL: Cathodoluminescence TSD: Threading screw dislocation
XRT: X-ray topography Raman: Raman spectroscopy SF: Stacking faults