Figure 8
From: Strategies for Controlled Placement of Nanoscale Building Blocks
Principle of electrical microcontact printing (e-μCP). (A) The flexible, metal-coated stamp is placed on top of a thin film of PMMA supported on a doped, electrically conducting Si wafer. (B) An external voltage is applied between the Au and the Si to write the pattern of the stamp into the electret. (C) The stamp is removed; the PMMA is left with a patterned electrostatic potential. (Reprinted with permission from Reference [122]. Copyright 2001 American Association for the Advancement of Science.)