Table 1 Deposition conditions, particle density, and size of metal particles on Si wafers
From: Catalytic activity of noble metals for metal-assisted chemical etching of silicon
Metal | Metal salt concentration(×10−3 mol dm−3) | Solution temperature (K) | Deposition time (s) | Average particle density (×1011 cm−2) | Average particle size (nm) |
|---|---|---|---|---|---|
Ag | 1.0 | 278 | 5 | 1.8 | 9 |
Au | 0.5 | 278 | 10 | 5.2 | 5 |
Pt | 1.0 | 313 | 90 | 0.066 | 50 |
Rh | 1.0 | 313 | 120 | 0.048 | 60 |