Figure 3From: Copper-selective electrochemical filling of macropore arrays for through-silicon via applicationsSelective TSV formation by local seed layer deposition. (a) Electrochemical etching of silicon leading to through-silicon macropore array formation. (b) Local deposition of the seed layer on one side of the sample. (c) The macropores sealed by the seed layer are selectively filled with copper.Back to article page