Table 1 Deposition parameters of different materials
Materials | Target/granules | Methods | Vacuum (Torr) | Ar gas (SCCM) | Power (Watt) | Deposition rate |
|---|---|---|---|---|---|---|
W | W target | RF sputtering | 1 × 10-5 | 25 | 150 | 12 nm/min |
GeO x | Ge target | RF sputtering | 2 × 10-5 | 25 | 50 | 5.3 nm/min |
Cu | Cu granules | Thermal evaporator | 8 × 10-6 | - | - | 2-3 Å/s |
Al | Al granules | Thermal evaporator | 8 × 10-6 | - | - | 2-3 Å/s |