Figure 1From: Released micromachined beams utilizing laterally uniform porosity porous siliconProcess to achieve released PS microbeams. (a) After PS formation and N2 annealing, (b) after first photolithographic step, (c) after RIE of PS and then removal of photoresist, (d) after second photolithographic step, (e) after metal lift-off and (f) after electropolishing and critical point drying.Back to article page