Fig. 9
From: Characteristics and Mechanism of Cu Films Fabricated at Room Temperature by Aerosol Deposition
Schematic diagram of initial mechanical interlocking on Al2O3 substrates and the growth of Cu films by the AD process. (a) Cu particle collision with high kinetic energy. (b) Flattened and deformed Cu particles on rough Al2O3 substrate. (c) Generation of Cu oxides due to hammering effect of the following particles. (d) Formation of dense Cu layer on hard and rough Al2O3 substrate