Fig. 14From: Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)Mechanism causing the Cu seed layer missing due to sponge-like defects and deep scallops. a After Si etch. b After Cu seed layer deposition. c Microscopic image of the Cu seed layer deposited at 60 μm × 250 μm TSV [45]Back to article page