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Fig. 10 | Nanoscale Research Letters

Fig. 10

From: Study of Effect of Impacting Direction on Abrasive Nanometric Cutting Process with Molecular Dynamics

Fig. 10

Different cutting angles cause to atomic displacements. Figure 10 describes atomic displacements of different cutting angles. When the single crystal SiC abrasive particles collide with the workpiece cutting copper in different directions, with SiC abrasive grains being cut, cutting depth increases, since the speed of the cutting direction is at 80 m/s, the [001] direction The moving speed is v z  = 0.8  sin θ, with increasing cutting depth of the cutting angle, [001] in the same cutting angle increases simulation steps, the depth of cut is large at the same time. a 0° displacement. b 5° displacements. c 10° displacement. d 15° displacement. e 20° displacement. f 25° displacement. g 30° displacement. h 35° displacement. i 40° displacement. j 45° displacement. (atomic color: HCP structure, BCC structure, FCC configuration as a white amorphous structure)

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