Fig. 4From: Effect of Fluid Media on Material Removal and Subsurface Defects Evolution of Monocrystal Copper in Nano-Cutting ProcessSubsurface defects distribution of workpiece during nano-cutting process in vacuum environment. The cutting distances of a, b, c, and d are 5 nm, 8 nm, 12 nm, and 15 nm, respectively.Back to article page