Table 1 Parameters used in the MD simulation
From: Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect
Configuration | Diamond cutting process |
|---|---|
Workpiece material | Single crystal copper |
Workpiece | Face-centred-cubic (FCC) structure |
Crystal structure | Lattice constant = 3.65 Å |
Workpiece size | 27 × 10 × 5nm3 |
Tool material | Diamond |
Cutting velocity | 25 m/s |
Tool edge radius | 0 nm, 2 nm, 3 nm, 4 nm, 5 nm, 7.5 nm, 10 nm |
Tool rake angle | 0° |
Tool clearance angle | 12° |