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Table 4 Young’s modulus of single crystal copper during nano-indentation with subsurface defects

From: Effect of Machining-Induced Subsurface Defects on Dislocation Evolution and Mechanical Properties of Materials via Nano-indentation

Maximum depth 2 nm

Indentation depth

0.5 nm

1 nm

1.5 nm

Maximum load depth (depth)

Young’s modulus E (GPa)

160.69

160.54

147.46

134.38 (1.8 nm)

Maximum depth 3 nm

Indentation depth

0.5 nm

1 nm

1.5 nm

86.57 (3.1 nm)

Young’s modulus E (GPa)

162.06

168.51

153.34

Indentation depth

2 nm

2.5 nm

3 nm

Young’s modulus E (GPa)

119.40

93.66

83.02

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